Suitable for normal industrial and professional applications. Base laminate conforms to all international standards and releases, as lisited in IPC4101A. RoHS compliant. Specifications Thickness:1.6mm Copper foil:35 micron Dissipation factor:35 Dielectric constant:5.4 Solderbath resistance (260°C): 20 secs Resist thickness:5 microns Spectral response:350-450nm, typical 2-3 minute exposure UV light energy required:Approx. 50mJ/cm Shelf life:1 year at 15-20°C
Suitable for normal industrial and professional applications. Base laminate conforms to all international standards and releases, as lisited in IPC4101A. RoHS compliant. Specifications Thickness:1.6mm Copper foil:35 micron Dissipation factor:35 Dielectric constant:5.4 Solderbath resistance (260°C): 20 secs Resist thickness:5 microns Spectral response:350-450nm, typical 2-3 minute exposure UV light energy required:Approx. 50mJ/cm Shelf life:1 year at 15-20°C
Suitable for normal industrial and professional applications. Base laminate conforms to all international standards and releases, as lisited in IPC4101A. RoHS compliant. Specifications Thickness:1.6mm Copper foil:35 micron Dissipation factor:35 Dielectric constant:5.4 Solderbath resistance (260°C): 20 secs Resist thickness:5 microns Spectral response:350-450nm, typical 2-3 minute exposure UV light energy required:Approx. 50mJ/cm Shelf life:1 year at 15-20°C
With a positive working photo-resist coating, protected by a peel-off plastic film. Suitable for normal industrial and professional applications. Base laminate conforms to all international standards and releases, as lisited in IPC4101A. RoHS compliant. Specifications Thickness:1.6mm Copper foil:35 micron Dissipation factor:35 Dielectric constant:5.4 Solderbath resistance (260°C): 20 secs Resist thickness:5 microns Spectral response:350-450nm, typical 2-3 minute exposure UV light energy required:Approx. 50mJ/cm Shelf life:1 year at 15-20°C